ELECTROnIC assembly

Performance Chemicals for

PoP Assembly

ECOREL™ Free PoP 10

• SAC 305

• Type 5 (15/25 microns)

• Application by dipping or dispensing

• Efficient and stable Bump Transfer by dipping

• Warpage defects are reduced

• No Halide, no Halogen

Solder Paste

Tacky Flux

ECOFREC™ PoP 50

• ROL0

• Application by dipping or dispensing

• Efficient and stable Bump Transfer by dipping

• Air Reflow

• No Halide, no Halogen

ECOFREC™ PoP 50 Black

• ROL0

• Application by dipping or dispensing

• Efficient and stable Bump Transfer by dipping

• Air Reflow

• No Halide, no Halogen

• Black color detected by optical inspection

Soldering materials for Package on Package and chip Scale package assembly compatible with Siplace LDU X and fuji Dipping modules.

INVENTEC PERFORMANCE CHEMICALS
 
500 Main Street, Suite 18,
PO Box 989, Deep River, CT 06417
Tel: 800-435-0317
Fax: 860-526-8243
www.inventecusa.com
Guadalajara, Jalisco C.P. 44890
Tel : +52 33 3838 8866
Fax : +52 33 3838 8867