AReparpplications
• SAC 305
• Type 5 (15/25 microns)
• Application by dipping or dispensing
• Efficient and stable Bump Transfer by dipping
• Warpage defects are reduced
• No Halide, no Halogen
Solder Paste
Tacky Flux
• ROL0
• Application by dipping or dispensing
• Efficient and stable Bump Transfer by dipping
• Air Reflow
• No Halide, no Halogen
ECOFREC™ PoP 50 Black
• ROL0
• Application by dipping or dispensing
• Efficient and stable Bump Transfer by dipping
• Air Reflow
• No Halide, no Halogen
• Black color detected by optical inspection
Soldering materials for Package on Package and chip Scale package assembly compatible with Siplace LDU X and fuji Dipping modules.
INVENTEC PERFORMANCE CHEMICALS
500 Main Street, Suite 18,
PO Box 989, Deep River, CT 06417
Tel: 860-526-8300
Fax: 860-526-8243
www.inventecusa.com
Guadalajara, Jalisco C.P. 44890
Tel : +52 33 3838 8866
Fax : +52 33 3838 8867
