knowledge Base
Knowledge Base
Solder Paste Residue Corrosivity Assessment : Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-004 corrosion tests … READ MORE
Vapor phase and convection reflow :
comparison of solder paste residue chemical reliability
Convection soldering remains the most common reflow process in electronic assembly, mostly in air, but sometimes using a nitrogen atmosphere to reduce oxidation. … READ MORE
Cleaning PCBs in electronics : understanding today's needs
Because of the phase out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residur No-Clean, to very low residut No-Clean. Many companies came out with their cleaning solutions … READ MORE
INVENTEC PERFORMANCE CHEMICALS
500 Main Street, Suite 18,
PO Box 989, Deep River, CT 06417
Tel: 860-526-8300
Fax: 860-526-8243
www.inventecusa.com
Guadalajara, Jalisco C.P. 44890
Tel : +52 33 3838 8866
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